NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia

News wire · Source based brief

NXP Semiconductors is doubling the capacity of its Malaysian assembly and test facility with a 500,000-square-foot expansion scheduled to begin production in early 2028. As the dominant supplier of RAIN RFID and NFC tag ICs, this massive scaling of NXP’s infrastructure is a critical move to stabilize the global supply chain and meet long-term volume demands for high-frequency tracking components.

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